HDI PCB Cost Breakdown: Why HDI PCBs Are More Expensive Than Standard PCBs
HDI PCB cost is one of the most frequently asked questions by engineers and sourcing teams.
Compared with standard multilayer boards, HDI PCBs typically cost 1.5×–3× more, and the difference is not only about materials.
This article explains the real cost drivers of HDI PCB manufacturing, from a factory and DFM perspective.
What Is an HDI PCB?
An HDI (High Density Interconnect) PCB uses advanced features such as:
Microvias
Blind and buried vias
Via-in-pad
Fine trace/space
Sequential lamination
These features allow higher routing density but significantly increase manufacturing complexity and risk.
Key Factors That Increase HDI PCB Cost
1. Sequential Lamination Cycles
Standard PCBs usually require one lamination cycle.
HDI PCBs often require two or more sequential lamination cycles, especially when blind or buried vias are used.
Each additional lamination cycle increases:
Process steps
Alignment difficulty
Yield loss
Lead time
👉 Lamination is one of the largest contributors to HDI PCB cost.
2. Laser Drilling for Microvias
Microvias in HDI PCBs are created by laser drilling, not mechanical drilling.
Laser drilling:
Is slower and more expensive
Requires high-precision equipment
Has strict depth and diameter limits
As a result, drilling-related costs for HDI PCBs are 2–5 times higher than standard boards.
3. Blind and Buried Vias
Blind and buried vias improve routing efficiency but significantly impact cost:
More complex layer registration
Mandatory X-ray and AOI inspection
Very limited rework options
Defects in buried vias often lead to full panel scrap, which is already reflected in the quotation.
4. Via-in-Pad Structures
Via-in-pad is common in HDI designs, especially under BGA packages.
However, via-in-pad requires:
Resin or copper filling
Planarization
Additional plating steps
This can increase HDI PCB cost by 10–20%, depending on design complexity and volume.
5. Fine Trace and Space
HDI PCBs typically require 3/3 mil or finer trace/space.
Finer features result in:
Lower manufacturing yield
Stricter inspection standards
Higher scrap rates
Even a small yield drop can noticeably increase final pricing.
Is Material Cost the Main Reason?
HDI PCBs often use:
High Tg FR-4
Thinner cores and prepregs
High-speed or low-loss materials (in some designs)
While material cost is higher than standard FR-4, process complexity and yield loss are the main cost drivers, not raw materials.
When HDI PCB Is Not Cost-Effective
HDI may not be necessary if:
Routing can be solved by adding layers
Through-hole vias meet electrical requirements
Assembly density is moderate
In many projects, a 6-layer standard PCB is cheaper and more reliable than a 4-layer HDI PCB.
How to Reduce HDI PCB Cost
To control HDI PCB cost:
Minimize sequential lamination cycles
Avoid unnecessary via-in-pad
Limit microvia depth and quantity
Keep trace/space within stable manufacturing limits
Communicate stackup and DFM early with the manufacturer
Early DFM review can often reduce HDI PCB cost by 20–30%.
Conclusion
HDI PCB cost is higher because manufacturing risk and complexity are higher, not because of higher margins.
Before choosing HDI technology, confirm that it is truly required, not just theoretically attractive.
If you are unsure whether your design really needs HDI, early discussion with a PCB manufacturer can save both cost and lead time.