We specialize in both low and high-volume PCB production with options including flexible, rigid, and multilayer PCBs. We use advanced technology and quality materials to meet industry standards.
We offer a variety of PCB materials including FR-4, Polyimide, PTFE (Teflon), and CEM1/CEM3, to cater to different applications and durability requirements.
For a PCB order, please provide Gerber files, specifications for material, board thickness, copper weight, surface finish, and any special requirements. A bill of materials (BOM) is also needed for assembly services.
We take client confidentiality seriously. All PCB designs are handled under strict non-disclosure agreements (NDAs) to ensure your project’s privacy and security.
Our quality assurance process includes electrical testing, visual inspection,and AOI (Automated Optical Inspection). We adhere to IPC standards to ensure each PCB meets the required specifications and performance.
Yes, we offer expedited services for urgent PCB orders to ensure quick turnaround times without compromising on quality. Please contact our sales team for specific timelines and additional costs.”
Yes, we provide PCB design services from basic schematics to complex PCBlayout, helping you streamline your product development process.
Process Capability
Category | Mass Production | Prototyping |
|---|---|---|
Layer Count | 1-20 layers | 1-30 layers |
Material | FR-4, High-frequency materials | FR-4, High-frequency materials |
Maximum Size | 500mm x 600mm | 500mm x 600mm |
Dimensional Accuracy
| ±0.13mm | ±0.1mm |
Board Thickness Range
| 0.2-4mm | 0.2-6mm |
Board Thickness Tolerance (>0.8mm) | ±8% | ±8% |
Board Thickness
Tolerance (<0.8mm)< span> | ±10% | ±10% |
Dielectric Thickness | 0.07-3.2mm | 0.07-5mm |
Minimum Line Width | 0.1mm | 0.075mm |
Minimum Solder
| 0.1mm | 0.075mm |
Outer Layer Copper
Thickness | 35-175µm | 35-280µm |
Inner Layer Copper
Thickness | 17-175µm | 17-280µm |
Drilling Hole Diameter(mechanical) | 0.15-6.35mm | 0.15-6.35mm |
Finished Hole
Diameter
(mechanical) | 0.1-6.3mm | 0.1-6.3mm |
Hole Tolerance
(mechanical | ±0.075mm | ±0.075mm |
Hole Position
Tolerance (mechanical) | ±0.05mm | ±0.05mm |
Board Thickness to
Hole Diameter Ratio | 10:01 | 13:01 |
Solder Mask Type | lpi | lpi |
Minimum Solder
Mask Bridge | 0.1mm | 0.075mm |
Plug Hole Diameter | 0.25-0.5mm | 0.25-0.6mm |
Impedance Tolerance | ±10% | ±10% |
Surface Treatment | Tin spraying, gold deposition, tin sinking, silver sinking, OSP, electro-gold fingers, nickel-palladium-gold | |
Board Type | Prototype ≤1 ㎡, Small batch 1-5 ㎡, Prototype ≥5 ㎡ |
Production Times
Category | Mass Production | Prototyping |
|---|---|---|
Double-sided Board | 1 day | 4 days, 7 days |
4-layer Board | 2 days | 6 days, 8 days |
6-layer Board | 3 days | 7 days, 10 days |
8-layer Board | 4 days | 8 days, 12 days |
10-layer Board | 5 days | 10 days, 14 days |
12-layer Board | 5 days | 12days, 16 days |
14-layer Board | 6 days | 14 days, 18 days |
16-layer Board and
Above | As per specific requirements |